Method for the manufacturing of a matrix and a matrix manufactured according to the method

ABSTRACT

The present invention relates to a method for the manufacture of a matrix and to a matrix ( 1 ) thus manufactured, at least one surface section ( 2 ) displaying a microstructure, which matrix ( 3 ) is suitable for inclusion as a mould insert in a mould cavity or in a cavity, in a unit producing plastic components, in order to assign said plastic components an opposing micostructure in a corresponding surface section. An original ( 3 ) with a surface section ( 4 ) displaying a microstructure less than 500 μm is used in order to apply on this original layer upon layer of a material ( 11, 12, 13, 14 ) and/or mixtures of material producing a matrix, and thereafter the matrix ( 1 ) is removed from said original ( 3 ) or the material in the original is removed. A first layer of material ( 11 ) applied on the original ( 3 ) so that together with a number of additional layers of material, said matrix is formed, is selected having exceptionally good properties as regards the ability of the plastic component to release from the matrix after moulding, curing or polymerisation of the plastic material used, and exceptionally good properties as regards retaining the pattern on the microstructured surface section.

TECHNICAL FIELD

The present invention relates in the first place to a method for themanufacture of a matrix using an original.

More particularly the present invention relates to a method for themanufacture of a matrix which will be able at least to display a surfacesection with a negative microstructure, intended for replication as apositive microstructure on an object, such as a plastic component,produced in a plastic moulding machine.

Matrices of this type are suitable for inclusion as a mould insert in amould cavity in a unit producing plastic components, in order to assignsaid plastic components a positive microstructure in a correspondingsurface section.

Concepts like negative or positive microstructure are used in thisapplication solely for the purpose of being able to elucidate thealtered shape of the microstructure in the matrix or in the mould-cavityinsert and the replicated microstructure in the plastic component.

The invention also relates to a matrix, suitably manufactured inaccordance with the method.

The manufacture of matrices in accordance with the method for thepresent invention is based on using an original with a surface sectiondisplaying a sharp positive microstructure in order to apply on thisoriginal at least one layer of material and/or a mixture of materialsproducing a matrix, this material having been selected to withstand theforces exerted on a mould-cavity insert in a machine for mouldingplastic components.

When the matrix or mould-cavity insert has been completely built up,measures are taken to remove the matrix from said original or remove thematerial in the original, so that the microstructure-related surfacesection of the matrix, with a sharp negative microstructure, willappear.

The present invention relates more particularly to use in applicationswhere the microstructure is chosen with a groove width or the like ofless than 500 μm, for instance in the range of 50-0.1 μm, but maynaturally be used for greater groove widths.

Although the invention indicates the possibility of forming a matrix,for inclusion in a unit producing plastic components such as amould-cavity insert, on an original such as a silicon disc, theinvention also enables a second matrix with reverse microstructure to beformed from such a matrix or the like.

BACKGROUND ART

Regarding the properties associated with the present invention it can bementioned that patent publication EP-A1-0 400 947 shows a method to bealready known for manufacturing a substantially independent diamond ordiamond-like film (16) with a desired profile, the method comprising:

the application of a thin carbide layer (14) on a fixed substrate (10)having a surface (12) with a form corresponding to the desired profile,

the application of a film (16) consisting of crystalline diamond or adiamond-like film, on the carbide layer (14), and removal of thesubstrate (10).

Patent publication EP-A10 417 924 shows a method for manufacturingmoulded diamond articles, the method comprising:

the formation of a reactive gas or chemical vapour, said gas comprisingactive carbon and means for forming a diamond deposit on a predeterminedsubstrate,

the use of a non-flat model of predetermined shape, the surface of themodel being such that a layer of diamond can be built up from saidvapour,

where the non-flat model is also assigned the ability to release adiamond layer formed by a chemical vapour phase being deposited thereon,

the formation of a layer of synthetic diamond against the non-flat modelby allowing the surface of the non-flat model to be brought into contactwith the vapour under such conditions that the diamond buildup producesa synthetic diamond article, the shape of which conforms to the shape ofthe non-flat model, and

removing the synthetic diamond article from said non-flat model.

Also pertaining to prior art is an article entitled “CVD Replication forOptics Applications” by Jitendra S. Goela and Raymond L. Taylor,published in SPIE, Vol. 1047, “Mirrors and Windows for High Power/HighEnergy Laser Systems” (1989), describing a deposition process using achemical vapour in order to replicate shapes, patterns and highlyreflective surfaces in optical material (ZnS, ZnSe) and mirror material(Si, SiC) transferable in infrared rays, for several applications.

A method is also known through patent publication EP-A1-0 442 303 forproducing three-dimensional workpieces or components made of diamond,comprising:

a) placing a model heated to a CVD diamond-forming temperature (500 to1100° C.) in a chamber, the model constituting a negative of theworkpiece,

b) applying or supplying a gas mixture of hydrocarbon/hydrogen to saidchamber at a pressure of 0.013 to 1334 mbar (0.01 to 1000 torr),

c) creating at least a partial degradation or decomposition of said gasmixture in, said chamber to form a CVD diamond layer on more than onesurface of said model, and

d) removing said model from said CVD diamond layer to produce saiddiamond workpiece, which will thus display the surface characteristicsof the surface of the model on which it was formed.

More particularly, FIGS. 5A, 5B and 5C show a step-shaped orgroove-shaped pattern manufactured from molybdenum, in which identicalparallel grooves form a check pattern with 5 mm spacing after machining.

Groove 32 has a width of 0.03 inch (0.76 mm) and a depth of 0.013 inch(0.33 mm), with 5 mm between the centre lines of the grooves. Thethickness of the plate is chosen as 3.81 mm.

Parts of the workpiece 34 are soldered to a carbide substrate in orderto produce a cutting tool.

Methods for manufacturing a matrix with at least one surface sectiondisplaying a negative microstructure, in which the matrix is suitablefor inclusion in a mould cavity, as a mould cavity insert in a unitproducing plastic components, in order to assign said plastic componentsa corresponding surface section with corresponding positivemicrostructure, wherein an original with a surface section displaying apositive microstructure is used in order to apply on this original layerupon layer of material and/or mixtures of material producing a matrix,and thereafter removing the matrix from said original or removing thematerial in the original, are also known.

In a method as described above it is also known to coat the negativemicrostructure, in a subsequent treating process, with a material layerthat per se has good durability qualities against stresses in theplastic moulding unit when used as a mould-cavity insert.

It is also known that each application of such additional, reinforcingmaterials on a matrix results in somewhat deteriorated exactitude in thenegative microstructure of the matrix, and thus somewhat deterioratedquality of the positive microstructure to be transferred to the plasticcomponent.

It is also known that the wear caused by a plastic compound on themould-cavity insert is considerable and that the surface displaying themicrostructure must be coated with a material that will stand up towear, particularly if the plastic compound contains an abrasive fillersuch as quartz.

Such filler materials may also be selected from materials that will givea low thermal expansion coefficient, such as 0 or close to zero, or mayoffer reinforcing properties from the mechanical aspect.

The following publications also pertain to prior art in this field:

D1) Patent Abstracts of Japan, abstract of JP 2 225 668, publ.1990-09-07 & JP-2 225 688-A and Derwent's abstract, No. 1990-316 827,week 9042.

A method is shown and described here for producing a core with an exactrelief-related pattern on its surface, a non-electrical plated coatingof a first layer on the surface of the core, and dipping the platedcorein an alectro-bath prior to oxidation of the non-electrical platingcoating is undertaken. A strong union is ensured between the model andthe non-electrical coating.

It is advocated here that an epoxy plastic is supplied via an inlet (9b), as a reinforcing agent (9 a), through which a counterdie (9) isformed with a reversed pattern (8). Thereafter a non-electrical platingcoating is applied on the counterdie or core (9) to produce a platedcoating (10).

This coating (10) increases in hardness since a mixture of a componentof a reducing agent in the plating bath and a plated metal is utilised,thus producing a reversed pattern (1).

Before the surface of the plated coating is oxidised or after thesurface has been roughened, an electro-formed layer 12 is applied on theabove surface.

By subsequently peeling off the above-mentioned laminating coatings ofthe counterdie (9), an electro-formed mould body (1) is obtained,consisting of a plated layer (10) and an electroformed layer (12), whichis improved from the adhesive aspect, and has an inverted pattern (11).

D2) Patent Abstracts of Japan, abstract of JP 3 342 787, publ.1991-10-30 & JP-3 243 787-A and Derwent's abstract, No. 1991-364 686,week 9150.

A mould (4) made of metal is shown here, provided with a mould-producingrecess in the form of a deep hole (51) with a ridge (52).

In this case a master with protrusions (11 and 12) corresponding to thehole (51) and the ridge (52) consists of aluminium.

A nickel-plated layer (2), including fine hard ceramic particles of SiC,TiC, TiN, etc, is formed on the surface of the master pattern (1).

A shell (3) consisting of nickel is also formed.

The pattern is dissolved in NaOH and removed, and the remaining part ofthe shell (3) is shaped to a specific size and inserted in the concavepart of the mould (4).

A plated layer is thus formed with a hard and uniform surface, in whichthe ceramic particle-shaped material is uniformly distributed andfacilitates release of the moulded product from the mould.

D3) EP-400 672-A2.

A technique is shown and described here for producing a mould enablingreplication of a large number of plastic components.

The mould displays a hologram or other microstructure to be transferredto the outside of a moulded article or component.

The mould is produced by electro-depositing a metal on the model of thearticle to be moulded.

Prior to this deposition the hologram or other microstructure shall beformed on the surface areas of the model by means of known technology.

D4) Patent Abstracts of Japan, abstract of JP 4 089 212, publ.1992-03-23 & JP-4 089 21 2-A and Derwent's abstract, No. 1992-147 406,week 9218.

An arrangement is shown here in which plastic is introduced between amould (1) and a glass lens (5), the plastic hardening so that a plasticlayer (4) is formed on the lens (5), with an intermediately orientedcarbon film (2).

D5) Patent Abstracts of Japan, abstract of JP 5 169 459, publ.1993-07-09 & JP-5 169 459-A and Derwent's abstract, No. 1993-252 170,week 9332.

This shows a base material for a mould and part of this is coated with ahard carbon film or diamond-like carbon film (DLC-film).

D6) EP-856 592-A1

This shows and describes a substrate (1) that is covered, at leastpartially, with a layer (1) consisting of a number of layer build-ups(2), each such build-up comprising:

a first diamond-like layer (3) consisting of nano-composites, nearestthe substrate and displaying co-operating networks of a C:H and a Si:O,

a second layer (4) consisting of diamond-like composites, over saidfirst layer (3),

an intermediate layer (5) between said first and second layers,consisting of a mixture of said first and second layer, and

when the number of layer structures above exceeds one (1), an additionalintermediately oriented layer (7) is provided.

D7) GB-2 284 175A

This shows and describes a mould with exceptionally good releasecapability, particularly in the production of golf-ball cores.

Also proposed is for the mould to be covered by a tungsten carbide layerwithin the range of 2 to 20 μm.

D8) U.S. Pat. No. 4,546,951-A

Here a mould is shown and described for encapsulating parts in a plasticmaterial.

A layer of hard material, such as a nitrite layer, is applied by meansof vapour deposition in vacuum at a high temperature on to at leastspecifically selected surface areas.

DESCRIPTION OF THE PRESENT INVENTION

Technical Problems

Considering that the technical deliberations a person skilled in the artmust perform in order to be able to offer a solution to one or more ofthe technical problems posed constitute initially an insight into themeasures and/or the sequence of measures to be taken, and also aselection of the means required, the following technical problems shouldbe relevant in developing the object of the present invention.

Considering the previous state of the art as described above, it wouldappear to be a technical problem to create such conditions that amatrix, produced against an original, shall have a durable firstmaterial layer for building up the matrix, where this material layershall also display such properties that, with simple additionaltreatments, the matrix can be placed directly in a mould half, as amould-cavity insert, in a unit for producing plastic components.

A technical problem exists in being able to select at least said firstmaterial layer for forming the matrix, with favourable propertiesappropriate for the intended future application, as regards suchcriteria as durability, predisposition of the plastic material torelease from the microstructured surface or surfaces of the matrix, andother equivalent conditions.

A technical problem is also entailed in being able to perceive thesignificance of and advantages associated with having a first thin layerof material applied against the original to form the matrix, be selectedwith exceptionally good durability properties in the manufacture ofplastic components, exceptionally good properties as regards the abilityand predisposition of the plastic component to release from the matrixafter moulding, curing or polymerisation of the plastic material used(low friction), and exceptionally good properties as regards retaining asharp pattern on the microstructured surface section.

A technical problem is also entailed in being able to perceive thesignificance of and advantages associated with selecting a thindiamond-related material layer as said first material layer that,besides hard and durable properties, also displays low friction andexceptionally good release properties from the moulded plasticcomponent.

It is furthermore a technical problem to be able to perceive thesignificance of and advantages associated with utilising applicationmethods based on a crystalline diamond coating, such as CVD (ChemicalVapour Deposition) technology (750-800 degrees C.) or PVD (PhysicalVapour Deposition) technology.

It is furthermore a technical problem to be able to perceive thesignificance of and advantages associated with utilising applicationmethods based on an application of a hard and durable material layerwith lower temperature requirements or DLC (Diamond-Like Carbon) layer(ca. 200 degrees C.), such as nitrides, carbides and the like.

It is thus a technical problem to select a layer produced using CVDtechnology or a DLC layer or some other layer material that has provedrelevant for a specific application.

A technical problem is also entailed in being able to perceive thesignificance of selecting said first material layer with a predeterminedthickness, the selected thickness being dependent on the material chosenfor the first material layer, the shape and dimensions of themicrostructure, and the choice of plastic material and of filler.

It would also appear to be a technical problem to be able to choose amaterial and/or a material mixture in a second and/or a third layer (anintermediate layer) in combination with a chosen thickness for thematerial in these layers.

A technical problem is also entailed in being able to perceive thesignificance of and advantages associated with selecting a utilisedoriginal in the form of a silicon disc or the like, with a positivemicrostructure thereon, and in having said silicon disc removable bymeans of a basic etching after the matrix has been built up.

A technical problem is also entailed in being able to perceive thesignificance of selecting KOH, NaOH or similar liquids for said basicetching.

A technical problem is also entailed in being able to perceive thesignificance of and advantages associated with selecting a mixture ofDLC and Ni as a second material layer.

A technical problem is also entailed in being able to perceive thesignificance of selecting said second material layer with a thicknessappropriate to the application.

A technical problem is also entailed in being able to perceive thesignificance of utilising a third material layer and, in that case,selecting only nickel or at least primarily nickel to form the thirdmaterial layer.

A technical problem is furthermore entailed in being able to perceivethe significance of selecting said third material layer with a thicknessappropriate to the application.

A technical problem is also entailed in being able to perceive thesignificance of selecting a plating of nickel material as a fourthmaterial layer and in selecting a thickness of said layer appropriate tothe application.

A technical problem is also entailed in being able to perceive thesignificance of applying said first material layer, consisting of a DLClayer, by means of a sputtering process.

A technical problem is also entailed in being able to perceive thesignificance of applying said second material layer, consisting of amixture of DLC and Ni, by means of a sputtering process.

Solution

In order to solve one or more of the above technical problems, the pointof departure for the present invention is a method for the manufactureof a matrix, and a matrix thus produced, with at least one surfacesection displaying a microstructure, which matrix is suitable forinclusion in a mould cavity or in a cavity, while forming a mouldinsert, in a unit producing plastic components, in order to assign saidplastic components an opposing microstructure in a corresponding surfacesection, an original being used in order to apply on this original layerupon layer of a material and/or mixtures of materials producing amatrix, and thereafter remove the matrix from said original or,preferably, remove the material in the original in order to expose thematrix and the surface pertaining to the microstructure.

In such a known method, it is proposed according to the invention that afirst layer of material is applied against the original so that,together with a number of additional layers of material, said matrix isformed, that the first layer of material is selected havingexceptionally good durability properties in the manufacture of plasticcomponents, exceptionally good properties as regards the ability of theplastic component to release from the matrix after moulding, curing orpolymerisation of the plastic material used, and exceptionally goodproperties as regards retaining the pattern on the microstructuredsurface section.

Preferred embodiments falling within the scope of the inventive conceptinclude the selection of a hard, durable, thin layer of material withlow friction and good release properties from the plastic material, forsaid first layer of material.

Said first material layer may be a crystalline diamond layer, such as aDLC layer or a layer that can be applied using CVD technology and/or PVDtechnology (Physical Vapour Deposition).

For certain applications the first material layer could also consist ofnitrides, carbides and the like.

The first material layer should be applied to a thickness of 0.1-100 μm.

A second material layer, with good adhesive capability to the firstmaterial layer, is applied on the first, where the second material layermay consist of DLC, titanium and/or chromium.

Said second material layer should be applied to a thickness of 0.05-2.0μm.

A third material layer, with good adhesive capability to the secondmaterial layer, is applied on the second layer and said third materiallayer may consist of a nickel layer.

Said third material layer should be applied to a thickness of 0.05-2.0μm.

Said second material layer and said third material layer may also becombined to an intermediately oriented layer having a chosen high DLCproportion or a high titanium and /or chromium concentration at aboundary surface to said first material layer and a high nickelconcentration at a boundary surface to a bulk material in the form of afourth layer, serving as mechanical support.

Said first material layer may preferably be chosen having a thickness of1-15μm.

The invention also advocates selecting a treated silicon disc or thelike with a chosen microstructure, as an original, and that said silicondisc can be removed by means of a basic etching.

The use of KOH, NaOH or equivalent basic liquids are proposed for thisbasic etching.

According to the invention a mixture of DLC and nickel may be selectedas a second material layer.

Said second material layer may preferably be chosen having a thicknessof 0.05-1.0 μm.

The invention also proposes applying a third layer of material andselecting nickel for this third material layer.

Said third material layer may then be chosen having a thickness of0.05-1.0 μm.

As a fourth layer of material the invention proposes that this beapplied in a plating process and shall consist of pure nickel.

Said fourth material layer may be chosen with a thickness appropriatefor the application.

The invention particularly advocates application of a DLC layer orsimilar by means of a sputtering process in combination with theapplication of DLC and nickel, serving as a second material layer, bymeans of a sputtering process.

The third material layer may also be applied by means of a sputteringprocess.

The second and the third material layers may also be applied,integrated, by means of a sputtering process.

The ratio between the proportion of DLC and the proportion of nickelshall advantageously be chosen varying through the layer and with 50% ofeach in the mid-region of the layer.

Advantages

The advantages that may primarily be deemed significant for a method inaccordance with the present invention, and a matrix manufactured inaccordance with the method, are that conditions have been created to beable, in a simple manner, to create a matrix suitable for a mould-cavityinsert, with a hard, durable, thin and sharp microstructured surfacefacing towards the plastic material in a moulding tool.

The material in this thin layer, which may comprise a DLC layer of0.1-100 μm, is such and so chosen that the microstructured surface ofthe matrix will display good release properties with regard to a chosenplastic material and the pattern in the matrix can be retained intactover a long period of time.

A matrix in accordance with the invention is built up of a number ofthin layers of material and a thick layer of bulk material, serving asmechanical support.

What is primarily deemed characteristic of a method for manufacturing amatrix in accordance with the present invention is defined in thecharacterizing part of the appended claim 1, and for a matrix preferablymanufactured by means of the method, is defined in the characterizingpart of the appended claim 27.

BRIEF DESCRIPTION OF THE DRAWINGS

A currently proposed matrix manufactured in accordance with the abovemethod, and various methods for manufacturing the matrix will now bedescribed in more detail with reference to the accompany drawings, inwhich

FIG. 1 shows a cross section through an original, to which a matrix hasbeen applied, built up of a number of layers of material, in accordancewith the present invention,

FIG. 2 shows schematically a method in accordance with the invention,adapted to a production line for producing a matrix in accordance withFIG. 1, and

FIG. 3 shows schematically a process in accordance with the invention,adapted to an alternative production line for producing a matrix asshown in FIG. 1, with a second and a third layer integrated with eachother.

DESCRIPTION OF PREFERRED EMBODIMENTS

Assuming that an original or master 3 has been removed, FIG. 1 shows amatrix 1 with at least one surface section 2 displaying a negativemicrostructure, the matrix being suitable for inclusion as amould-cavity insert in a mould or cavity in a unit producing plasticcomponents, in order to assign said plastic components a correspondingsurface section with a positive microstructure.

This is not shown in more detail in the drawings but constitutes afamiliar circumstance to one skilled in the art.

The invention relates to a method and a matrix 1 manufactured inaccordance with the method.

The method assumes the existence of an original 3, and that thisoriginal has been provided in known manner with a microstructuredsurface 4, which surface is to serve as a counter-surface for a matrix 1built up on the original 3.

An original 3 having a surface section 4 provided with a positivemicrostructure shall thus be used, and layer upon layer of a materialand/or mixtures of materials producing a matrix shall be applied on theoriginal 3, the matrix 1 there after being removed from said original 3or, preferably the material in the original being removed, therebyexposing the microstructured surface or surface section 2 of the matrix1.

The present invention advocates the use of a first durable layer ofmaterial 11 applied against the original 3 in order, together with asecond, a third, and/or a fourth material layer serving as mechanicalsupport and as bulk material, these layers being designated 12, 13 and14, to form the complete matrix 1.

Said first layer of material 11 shall be selected from material havingexceptionally good strength properties in the production of plasticcomponents, exceptionally good properties as regards the ability of theplastic component to release (low friction) from the matrix aftermoulding, curing or polymerisation of the plastic material used, andexceptionally good properties as regards retaining a sharp pattern onthe microstructured surface section.

A hard, durable, thin material layer with low friction and/of goodrelease properties shall be chosen as said first material layer 11.

A crystalline diamond layer or a DLC layer is particularly recommendedfor the first material layer 11.

It is suggested that the first material layer 11 may be applied by meansof CVD technology and/or PVD technology.

For certain applications the first material layer might also consist ofnitrides, carbides and the like.

Practical experience dictates that the first material layer 11 shall beapplied to a thickness of 0.1-100 μm, e.g. 0.5-50 μm, or more precisely1-15 μm. However, this depends on the plastic material, the fillerchosen, application and microstructure.

A second material layer 12, with good adhesive capability to the firstmaterial layer 11, is now applied on the first material layer 11.

Said second material layer 12 may consist of titanium and/or chromium,or of a mixture of DLC and nickel.

Said second material layer 12 should be applied to a thickness of0.05-2.0 μm, e.g. 0.1-1.0 μm.

A third material layer 13, with good adhesive capability to the secondmaterial layer 12, is now applied on the second layer 12.

Said third material layer 13 is recommended to consist of nickel.

Said third material layer 13 is applied to a thickness of 0.05-2.0 μm,e.g. 0.1-1.0 μm.

Said second material layer 12 and said third material layer 13 may,however, be combined to an intermediately oriented layer having a purelydiamond layer and/or a high titanium and /or chromium concentration at aboundary surface 11 a against said first material layer 11 and a highnickel concentration at a boundary surface 13 a against a bulk materialin the form of a fourth layer 14, serving as mechanical support.

A crystalline diamond layer or other material layer with equivalent, orat least substantially equivalent properties, may be used for saidmaterials for the application shown here.

Said first material layer'shall normally be chosen having a thickness of1-15 μm.

An embodiment of the invention is shown by way of example in which atreated silicon disc 3 with a positive microstructure 4 is selected asoriginal, and said silicon disc is removed by means of a basic etching.Liquids, KOH, NaOH or the like may be selected in a chosen concentrationfor the basic etching.

The invention also shows the use of a second material layer 12 and thismay be chosen as a mixture of DLC and nickel, with a predetermined ratioof the ingredients.

Said second material layer 12 may advantageously be chosen having athickness of 0.05-1.0 μm.

The embodiment also illustrates the selection of nickel for the thirdmaterial layer.

Said third material layer 13 may be chosen having a thickness of0.05-1.0 μm.

A fourth material layer 14 is chosen consisting of a nickel plating andsaid fourth material layer may be chosen with a thickness appropriatefor the application.

The present invention particularly advocates the first layer 11, such asthe DLC layer, being applied by means of a sputtering process. This hasbeen found suitable in distributing the DLC layer well along themicrostructured surface section 4.

According to the invention a second material layer, in the form of amixture of DLC and nickel, may also be applied, said second materiallayer 12 being applied by means of a sputtering process on the firstlayer 11 in order to obtain good adhesion between them. A highproportion of DLC shall thus abut the layer 11 and a high proportion ofnickel shall face the layer 14, and the layer 13 may be omitted.

The third material layer 13 is also applied by means of a sputteringprocess.

The second and the third material layers 12, 13 may be applied,integrated, by means of a sputtering process.

FIG. 2 illustrates how an original 3, provided with amicrostructure-related surface section 4 is coated with a first DLClayer 11, or corresponding layer, in a first station 21, by means knownper se, through a sputtering process.

By subsequently moving the original 3 to an adjacent station 22, merelyindicated in FIG. 2, the first layer 11 can be coated with a secondlayer 12 by means of a sputtering process. The second layer 12 isnecessary in order to obtain good adhesion to the first layer 11 and maybe termed an intermediate layer.

The second layer 12 may consist of titanium or chromium. Or it mayconsist of a mixture of DLC and nickel.

Further transfer of the original 3 to a station 23 allows a third layer13 to be applied on the second layer 12, also by means of a sputteringprocess. The original 3 is finally transferred to a station 24 forapplication of a fourth material layer 14 by means of plating.

A combined unit consisting of a matrix 1 and an original 3, as shown inFIG. 1, exists after station 24 and in a station 25 conditions are nowcreated for being able to remove the material in the original 3 by meansof said basic etching, thereby revealing a matrix 1 which is directlysuitable for use in a mould half in a unit for producing plasticcomponents, with an extremely good and exact microstructure 4.

FIG. 3 shows one embodiment of a production line in which a station 21,as shown in FIG. 2, applies a first material layer 11 on the original 3and its microstructured surface portion 4.

A station (22, 23) is here so designed that when the original 3 passes,the material layer 11 is coated first with a very high proportion of DLCand a very small proportion of nickel (designated DLC in FIG. 3), and asthe original 3 is moved along in the direction of the arrow, the samesurface portion of the layer 11 will be coated with a mixture of DLC andnickel in which the proportion of DLC decreases in favour of anincreased share of nickel which, near the right-hand part of FIG. 3,constitutes an overwhelming proportion, e.g. 100% (designated Ni in FIG.3).

The material layer 14 is applied to a suitable thickness in a platingstation 24.

It can also be ascertained that certain applications require the use ofa crystalline diamond layer 11, to provide a hard and durable materiallayer 11 as a thin material film.

If low friction and good release properties are to appear between theplastic component and the microstructured surface 4, and if atemperature as high as 750-800 degrees C. may be permitted, the use ofthe CVD diamond process is recommended here.

A hard surface with hardwearing properties can also be achieved at lowertemperatures, e.g. 200° C. if DLC, nitrides and/or carbides are used forthe first material layer 11. Titanium nitride, titanium carbide,aluminium oxides and mixtures thereof may also be used.

The layer 12, or the combination of layers 12 and 13, is constituted byan intermediate layer. This shall on the one side adhere well to thelayer 11, and on the other side adhere well to the layer 14.

The adhesion between layers 11 and 12 or between 11 and 12+13 requirescrystalline diamond, titanium or chromium, and the adhesion betweenlayers 13 and 14 requires nickel.

If the material chosen for the layer 12 is titanium or chromium, thematerial chosen in the layer 13 may be nickel.

The original 3 may be manufactured in accordance with lithographicprocesses, using masking and etching, machining and the like.

If the material layers 12 and 13 are integrated, the total thickness ofthese may be between 0.1-3 μm, e.g. 0.5-1.5 μm.

Furthermore, the dimension of the microstructure applicable for thepresent invention shall be measured as indicated by -b- in FIG. 1. It isthus the width of the microstructure-related grooves that is decisivefor the measurement, not the depth of the grooves.

In a practical application of the present invention it may be mentionedthat the value of -b- may be chosen with advantage from approximately500 μ and down to 0.20-0.5 μm.

The invention is applicable: when the width of the microstructure ischosen within the narrowest interval and is such that the material layer11 will completely fill and cover the groove 3 a, thus forming a seal.This is not, however, shown in FIG. 1 but can easily be imagined.

The favourable, harmonic fit of the layers 11, 12 and 13 to each otherin the groove 3 a is, however, exaggeratedly simple in FIG. 1.

The choices of material stated in the above example, and the choices ofmaterial stated in the claims, may be considered as currentlyrecommended and may be replaced with other choices without departingfrom the inventive concept.

The invention is naturally not limited to the embodiment described aboveby way of example but may undergo modifications within the scope of theinventive concept illustrated in the appended claims.

What is claimed is:
 1. A method for the manufacture of a matrix havingat least one surface section or layer displaying a negativemicrostructure, the matrix being suitable for inclusion as a mouldinsert in a mould cavity or in a cavity in a unit for producing plasticcomponents, in order to assign at least one part or surface of saidplastic components an opposing or positive microstructure in acorresponding surface section, whereby said layer is exposing theconditions of hardness and wear resistance, the method comprisingforming said matrix by providing an original having a surface sectiondisplaying a positive microstructure; applying onto said originalsuccessive layers of different materials or mixtures of materials forbuilding up and producing said matrix, and thereafter either removingsaid matrix from said original or removing the material building up saidoriginal to manufacture a microstructure related surface section of thematrix, that has a sharp negative microstructure; a. wherein saidsurface section related to the original is caused to display saidpositive microstructure, b. wherein said first matrix related layer is amaterial having an ability to release the matrix surface from theproduced plastic components after moulding, curing or polynerization, c.wherein said selected material, according to “b”, also retains thepattern on the negative microstructured surface section related to saidfirst layer, d. wherein said material in said first layer is acrystalline diamond, a DLC, a nitride, or a carbide, e. wherein saidfirst layer is applied onto said original in a thickness of 0,1-100 μm;and f. wherein a second material layer, having an adhesive capability tothe first material layer, is applied onto said first material layer. 2.A method as claimed in claim 1, wherein said second material layerconsists of titanium and/or chromium.
 3. A method as claimed in claim 1,wherein said second material layer is applied in a thickness of 0.05-2.0μm.
 4. A method as claimed in claim 1, wherein a third material layer,with adhesive capability to said second material layer, is applied ontothe second layer.
 5. A method as claimed in claim 4, wherein said thirdmaterial layer consists of nickel.
 6. A method as claimed in claim 4wherein said third material layer is applied in a thickness of 0.05-2.0μm.
 7. A method as claimed in claim 4, wherein said second materiallayer and said third material layer are combined to an intermediatelyoriented layer, having a high DLC, titanium or chromium concentration ata boundary surface against said first material layer and a nickelconcentration at a boundary surface against a bulk material, in the formof a fourth layer and said fourth layer serving as mechanical support.8. A method as claimed in claim 1, wherein said first material layer hasa thickness of 1-15 μm.
 9. A method as claimed in claim 1, wherein saidoriginal comprises a treated silicon disc, with a chosen microstructure,the method comprising removing said silicon disc by a basic etchingprocess.
 10. A method as claimed in claim 9, wherein said basic etchingis with KOH or NaOH.
 11. A method as claimed in claim 1, wherein saidsecond material layer is a mixture of DLC or the equivalent and nickel.12. A method as claimed in claim 1, wherein said second material layerhas a thickness of 0.05-1.0 μm.
 13. A method as claimed in claim 4,wherein said third material layer is of nickel only.
 14. A method asclaimed in claim 4, wherein said third material layer has a thickness of0.05-1.0 μm.
 15. A method as claimed in claim 4, wherein a fourthmaterial layer is applied as a plating of a nickel material.
 16. Amethod as claimed in claim 15, wherein said fourth material layer ischosen with a thickness appropriate for an application.
 17. A method asclaimed in claim 1, further comprising applying said DLC layer by asputtering process.
 18. A method as claimed in claim 1, furthercomprising applying said second material layer by a sputtering process.19. A method as claimed in claim 4, further comprising applying saidthird material layer by a sputtering process.
 20. A method as claimed inclaim 4, further comprising applying said second and third materiallayers by a sputtering process.
 21. A matrix manufactured according tothe method of claim
 1. 22. A matrix manufactured according to the methodof claim
 4. 23. A matrix manufactured according to the method of claim7.
 24. A matrix manufactured according to the method of claim 13.